发明名称 SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE
摘要 <p>A polishing solution containing abrasive grains, an additive, and water. Said abrasive grains contain a hydroxide of a tetravalent metal, and an aqueous dispersion containing said abrasive grains in the amount of 1.0 mass% exhibits an absorbance of at least 1.00 but less than 1.50 with respect to light having a wavelength of 400 nm. Furthermore, centrifuging the aqueous dispersion containing the abrasive grains in the amount of 1.0 mass% for 50 minutes at a centrifugal acceleration of 1.59×105 G yields a liquid phase with a non-volatile content of at least 300 ppm.</p>
申请公布号 WO2013175856(A1) 申请公布日期 2013.11.28
申请号 WO2013JP58782 申请日期 2013.03.26
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 IWANO TOMOHIRO;MINAMI HISATAKA;AKUTSU TOSHIAKI;FUJISAKI KOJI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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