发明名称 |
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE |
摘要 |
<p>A polishing solution containing abrasive grains, an additive, and water. Said abrasive grains contain a hydroxide of a tetravalent metal, and an aqueous dispersion containing said abrasive grains in the amount of 1.0 mass% exhibits an absorbance of at least 1.00 but less than 1.50 with respect to light having a wavelength of 400 nm. Furthermore, centrifuging the aqueous dispersion containing the abrasive grains in the amount of 1.0 mass% for 50 minutes at a centrifugal acceleration of 1.59×105 G yields a liquid phase with a non-volatile content of at least 300 ppm.</p> |
申请公布号 |
WO2013175856(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
WO2013JP58782 |
申请日期 |
2013.03.26 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
IWANO TOMOHIRO;MINAMI HISATAKA;AKUTSU TOSHIAKI;FUJISAKI KOJI |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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