发明名称 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To cause each probe of a probe unit to surely perform probing into a plurality of probing targets on a substrate.SOLUTION: The substrate inspection device comprises: a movement mechanism that causes probes (201a and 201c) of a probe unit to perform probing into the plurality of probing targets (bump 101a); and a process part that identifies a correction value for correcting a position deviation between a probing position of each probe and the probing target to correct the position deviation, and is configured to enable an inspection of a substrate. In an inspection causing a pair of probes to perform the probing into one probing target to thereby enable the inspection thereof, when a combination of a pair of probes and one probing target plurally exists, the process part performs an identification process identifying a separation distance (La1) between a midpoint (Pm1) of a line segment connecting each probing position of the pair of probes in one combination and a central part (Cs1) of the probing target therein as the correction value as to a plurality of combinations thereof.
申请公布号 JP2013238435(A) 申请公布日期 2013.11.28
申请号 JP20120110165 申请日期 2012.05.14
申请人 HIOKI EE CORP 发明人 OGAWARA TAKESHI
分类号 G01R31/28;G01R31/02;H05K3/00 主分类号 G01R31/28
代理机构 代理人
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