TESTING STRUCTURE AND METHOD OF USING THE TESTING STRUCTURE

摘要

A metal-to-metal leakage and breakdown testing structure for semiconductor structures and method of using the testing structure is disclosed. The testing structure includes plurality of resistor bridges connected to respective two terminal devices. The testing structure further includes a plurality of switches each having a voltage node provided between resistors of a respective one of the plurality of resistor bridges. The voltage node is read at a circuit pad when a respective one of the plurality of switches is in an on state. The testing structure further includes a device turning on and off each of the plurality of switches, individually.