发明名称 |
A PACKAGE, MADE OF BUILDING MATERIAL, FOR A PARAMETER MONITORING DEVICE, WITHIN A SOLID STRUCTURE, AND RELATIVE DEVICE |
摘要 |
<p>A package (15) for devices (100) insertable into a solid structure (300) for detecting and monitoring one or more local parameters is described. The package (15) is made of a building material formed of particles of micrometric or sub-micrometric dimensions. A device (100) for detecting and monitoring one or more local parameters within a solid structure is further described. The device (100) comprises an integrated detection module (1), having at least one integrated sensor (10), and a package (15), having the above-mentioned characteristics, so arranged as to coat at least one portion of the device (100), comprising the integrated detection module (1). A method for manufacturing the device (100), and a system (200) for monitoring parameters in a solid structure (300), comprising such a device (100), are also described.</p> |
申请公布号 |
WO2013174946(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
WO2013EP60669 |
申请日期 |
2013.05.23 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
PAGANI, ALBERTO;MURARI, BRUNO;ZIGLIOLI, FEDERICO GIOVANNI;RONCHI, MARCO;RICOTTI, GIULIO |
分类号 |
G01D11/24;G01M5/00 |
主分类号 |
G01D11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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