发明名称 A PACKAGE, MADE OF BUILDING MATERIAL, FOR A PARAMETER MONITORING DEVICE, WITHIN A SOLID STRUCTURE, AND RELATIVE DEVICE
摘要 <p>A package (15) for devices (100) insertable into a solid structure (300) for detecting and monitoring one or more local parameters is described. The package (15) is made of a building material formed of particles of micrometric or sub-micrometric dimensions. A device (100) for detecting and monitoring one or more local parameters within a solid structure is further described. The device (100) comprises an integrated detection module (1), having at least one integrated sensor (10), and a package (15), having the above-mentioned characteristics, so arranged as to coat at least one portion of the device (100), comprising the integrated detection module (1). A method for manufacturing the device (100), and a system (200) for monitoring parameters in a solid structure (300), comprising such a device (100), are also described.</p>
申请公布号 WO2013174946(A1) 申请公布日期 2013.11.28
申请号 WO2013EP60669 申请日期 2013.05.23
申请人 STMICROELECTRONICS S.R.L. 发明人 PAGANI, ALBERTO;MURARI, BRUNO;ZIGLIOLI, FEDERICO GIOVANNI;RONCHI, MARCO;RICOTTI, GIULIO
分类号 G01D11/24;G01M5/00 主分类号 G01D11/24
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