| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for downsizing a mechanism for a substrate delivery step by improving efficiency of the substrate delivery step in a plasma film-forming apparatus.SOLUTION: A plasma film-forming apparatus 300 is equipped with first and second film-forming treatment systems 301 and 302 that alternately perform a film-forming treatment. The first and second film-forming treatment systems 301 and 302 are each equipped with a delivery mechanism 310, a vacuum spare chamber 320 and a film-forming chamber 330. The delivery mechanism 310 is equipped with a cylinder shaft 311 having a tip to which a substrate-holding part 325 for holding a substrate 5 is connected. In the plasma film-forming apparatus 300, the substrate-holding part 325 on which the substrate 5 is placed is delivered from the vacuum spare chamber 320 to the film-forming chamber 330 by linearly sliding the cylinder shaft 311 with a gate valve 322 being opened. The cylinder shaft 311 has a valve body 324 attached thereto, wherein the valve body 324 blocks an inlet of the film-forming chamber 330 when the substrate-holding part 325 is housed in the film-forming chamber 330. |
