| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board, in which manufacturing steps can be simplified.SOLUTION: A method for manufacturing a multilayer circuit board, includes: arranging conductive paste 123 for constituting a surface pad to each of discrete regions in one green sheet 120 of a plurality of green sheets 110-140; in each of discrete regions of green sheets 130 and 140 to be laminated on the green sheet 120 having the conductive paste 123 for constituting the surface pad arranged thereon, then exposing the conductive paste 123 for constituting the surface pad when the green sheets 130 and 140 are laminated, and forming through holes 131 and 141 having first break lines 81 passing thereon; in each of the discrete regions of at least one green sheet 140 of the green sheets 130 and 140 having the through holes 131 and 141 formed therein, then arranging conductive paste 142 for constituting a side pad in a side wall constituting the through hole 141; and then integrally laminating the green sheets 110-140 to divide the laminate into respective discrete regions. |
