WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which attains proper substrate strength and enables a through electrode to be formed in a through hole of a substrate with high yield and high production efficiency.SOLUTION: A wiring board includes: a first silicon substrate 10 including a first through conductor part 20 and formed by a wafer; a second silicon substrate 30 which is laminated on the first silicon substrate 10, includes a second through conductor part 40 formed so as to be aligned with the first through conductor part 20, and is formed by a wafer; a first insulation layer 12 formed on an outer surface of the first silicon substrate 10; and a second insulation layer 32 formed on an outer surface of the second silicon substrate 30. The first insulation layer 12 on the upper surface side of the first silicon substrate 10 and the second insulation layer 32 on the lower surface side of the second silicon substrate 30 are directly jointed to each other. Further, an adhesion resin layer 19 is formed between an inner surface of a second through hole TH and the second penetration conductor part 40, and a through electrode TE is formed by integrating the first through conductor part 20 with the second through conductor part 40.