发明名称 SUBSTRATE FOR NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a nitride semiconductor device and a manufacturing method of the same, which can form a nitride semiconductor layer having a good crystal state by a vapor-phase epitaxial method.SOLUTION: A manufacturing method of a substrate for a nitride semiconductor device including an aluminum silicon nitride (AlSiN) layer which has a composition of AlSiN (where 0.5<x<0.99) and which is formed by a vapor-phase epitaxial method, comprises: an aluminum silicon nitride (AlSiN) layer formation process of forming an aluminum silicon nitride (AlSiN) layer having a composition of AlSiN (where 0.5<x<0.99) on a substrate for growth by the vapor-phase epitaxial method; and an aluminum silicon nitride (AlSiN) layer separation process of separating the formed aluminum silicon nitride (AlSiN) layer from the substrate for growth.
申请公布号 JP2013239558(A) 申请公布日期 2013.11.28
申请号 JP20120111316 申请日期 2012.05.15
申请人 UNIV OF TOKUSHIMA;USHIO INC 发明人 NISHINO KATSUSHI;NAKAUCHI JUN;TSUKIHARA MASASHI
分类号 H01L21/205;C30B29/38 主分类号 H01L21/205
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