| 摘要 |
A drive substrate, including: an insulating substrate (10); an internal connection terminal (12b) made of ITO or IZO provided on the substrate (10); and a lead interconnect (14) that is connected to the connection terminal (12b) with one end thereof lying on the connection terminal and is led out to an outer edge of the insulating substrate (10) at the other end thereof, wherein a contact portion of the lead interconnect (14) with the internal connection terminal (12b) is formed of a barrier metal layer (15A) made of titanium nitride (TiN) and the nitride concentration thereof is between 35 atoms/cm2 and 65 atoms/cm2 inclusive.
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