发明名称 |
Composition for removing residue from wiring board and cleaning method |
摘要 |
<p>A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.</p> |
申请公布号 |
IL192278(A) |
申请公布日期 |
2013.11.28 |
申请号 |
IL20080192278 |
申请日期 |
2008.06.18 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY INC.;EIKO KUWABARA;HIDEO KASHIWAGI;HIROSHI MATSUNAGA;MASARU OHTO |
发明人 |
EIKO KUWABARA;HIDEO KASHIWAGI;HIROSHI MATSUNAGA;MASARU OHTO |
分类号 |
B08B;C11D;C23G;G03F |
主分类号 |
B08B |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|