| 摘要 |
PROBLEM TO BE SOLVED: To provide a gas barrier film high in gas barrier performance and reduced in the lowering of the gas barrier performance in a post-processing process.SOLUTION: A gas barrier film is formed by sequentially laminating the following [A] layer, [B] layer and [C] layer on at least a single face of a polymer base material. [A] layer: a first bridging resin layer whose pencil hardness is not lower than H and surface free energy is not higher than 45mN/m. [B] layer: a silicon-containing inorganic layer whose thickness is 10 to 1,000 nm. [C] layer: a second bridging resin layer whose pencil hardness is not lower than H and thickness is 0.05 to 10 μm. |
