| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can use a general-purpose semiconductor chip which is microfabricated with less constraints of a wiring rule on a printed circuit board side, and which has high reliability in an electric junction part, and which can be manufactured at low cost.SOLUTION: A semiconductor device comprises a semiconductor chip, a relay substrate, a surface circuit pattern and a post array. The surface circuit pattern includes: a chip-side pad group which is formed on one surface of the relay substrate and connected to an external connection pad of the semiconductor chip; a relay interconnection group that leads to the chip-side pad group and expands and extends to an outer periphery side of the relay substrate; and a relay pad group that leads to an end of each relay interconnection on the side opposite to the chip-side pad. The post array includes a plurality of electrically-conducting paths formed to extend in a direction intersecting a surface of the relay substrate, in which the electrically-conducting paths are insulated by an insulation resin from each other, and ends of the electrically-conducting paths are connected to the relay pads and the other ends of the electrically-conducting paths on the side opposite to the relay substrate are connected to a printed circuit board side. |
