发明名称 THIN FILM FORMING POSITION, AND REPAIRING METHOD AND ADJUSTING METHOD FOR THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming device which can swiftly perform recovery processing when a failure occurs in a nozzle hole.SOLUTION: A base is held by a holding face of a stage. A nozzle head is opposed to the base held by the stage. The nozzle head has a plurality of nozzle holes for discharging droplets of thin film materials toward the base. A moving mechanism moves the stage to a direction in parallel with the holding face with respect to the nozzle head. An imaging device is configured to be able to move to the nozzle head, and to move to a position at which the nozzle holes can be imaged.
申请公布号 JP2013237004(A) 申请公布日期 2013.11.28
申请号 JP20120111095 申请日期 2012.05.15
申请人 SUMITOMO HEAVY IND LTD 发明人 OKAMOTO YUJI
分类号 B05C5/00;B05C11/10;B05C21/00;B05D1/26;B05D3/00 主分类号 B05C5/00
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