| 摘要 |
<p>A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f(1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a>=0, b>=0, c>=0, d>=0, e>=0, f>=0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.</p> |
