发明名称 APPARATUS FOR CUTTING OF NON-METALLIC SUBSTRATE
摘要 <p>PURPOSE: A cutting apparatus of a non-metal substrate is provided to spray the equal amount of coolant on a heated non-metal substrate by the laser bean by removing a bubble included in the coolant. CONSTITUTION: A cutting apparatus of a non-metal comprises a base unit(100), a scribing unit(200), and a cooling unit(300). The non-metal substrate(G) is settled on the base unit. The scribing unit it arranged on the top of the base unit, and the laser beam is radiated on the cutting part of the non-metal substrate. The cooling unit comprises a mist spraying part(330) and a filtering part(310). The mist spraying part sprays the coolant on the heated non-metal substrate by the scribing unit. The filtering unit removes the bubble included in the coolant provided to the mist spraying part. The cooling unit additionally includes a bubble inspecting part(320) and the bubble inspecting part detects the bubble inclusion of coolant supplied to the mist spraying part.</p>
申请公布号 KR101333487(B1) 申请公布日期 2013.11.28
申请号 KR20120028873 申请日期 2012.03.21
申请人 发明人
分类号 C03B25/00;C03B33/02;C03B33/033 主分类号 C03B25/00
代理机构 代理人
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