| 摘要 |
PROBLEM TO BE SOLVED: To provide a method that enables accurate evaluations in the case of performing evaluations by applying a laser beam and detecting the scattered light from a wafer surface with a detector.SOLUTION: Provided is a method that performs evaluations of a wafer surface by applying a laser beam to the wafer surface and detecting the scattered light from the wafer surface with a detector. In the method, the plurality of detectors are arranged to detect the scattered light respectively, and on the basis of their respective detection results, the evaluations are performed. |
