EASILY DEFORMABLE AGGREGATES AND PROCESS FOR PRODUCING SAME, THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE MEMBER AND PROCESS FOR PRODUCING SAME, AND THERMALLY CONDUCTIVE ADHESION SHEET

摘要

The purpose of the present invention is to provide a thermal-conductivity imparter which, when used in a smaller amount, can impart thermal conductivity comparable to that of conventional thermal-conductivity imparters and which, when used in an amount comparable to that for conventional thermal-conductivity imparters, can impart higher thermal conductivity. The thermal-conductivity imparter is easily deformable aggregates (D) which comprise 100 parts by mass of thermally conductive particles (A) having an average primary-particle diameter of 0.1-10 µm and 0.1-30 parts by mass of an organic binder (B) and which have an average particle diameter of 2-100 µm and an average compressive force required for 10% deformation of 5 mN or less.