发明名称 BINDING MATERIAL, BINDING BODY, AND BINDING METHOD
摘要 There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.
申请公布号 KR20130129392(A) 申请公布日期 2013.11.28
申请号 KR20137016031 申请日期 2011.05.13
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 KURITA SATORU;ENDOH KEIICHI;SAITO YU;HISAEDA YUTAKA;UEYAMA TOSHIHIKO
分类号 H01L21/60 主分类号 H01L21/60
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