APPARATUS FOR TRANSPORTING SEMICONDUCTOR CHIP

摘要

An apparatus for transferring a semiconductor chip is provided. The apparatus for transferring the semiconductor chip according to one embodiment of the present invention includes a moving plate which is movably installed on a rail, a concave groove which is formed on one side of the moving plate, and a flux supply module which supplies flux to the moving plate, and a squeeze which pushes the flux in the preset direction of the moving plate to fill the concave groove with the flux. The inner side of the concave groove is tapered in a central direction.