发明名称 |
MULTILAYER STYRENIC RESIN SHEET |
摘要 |
Disclosed are a multilayer styrenic resin sheet comprising 10 to 50 laminated layers which are each made of a styrenic resin composition that comprises 29 to 65 mass% of a styrene/conjugated diene copolymer (A), 51 to 15 mass% of a polystyrene resin (B) and 20 to 9 mass% of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 um; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220 °C is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass% relative to 100 mass% of the copolymer (A). |
申请公布号 |
EP2666630(A1) |
申请公布日期 |
2013.11.27 |
申请号 |
EP20120737118 |
申请日期 |
2012.01.16 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
AOKI YUTAKA;TAKEI ATSUSHI;HIROKAWA YASUSHI;MASUDA YUSUKE |
分类号 |
B32B27/30;B65D65/40;B65D73/02;B65D85/86;C08L25/06;C08L51/04;C08L53/02 |
主分类号 |
B32B27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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