发明名称 RESIN COMPOSITION, PREPREG AND LAMINATE
摘要 <p>[Problem to be Solved] It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. [Solution] A resin composition according to the present invention comprises a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.</p>
申请公布号 EP2666821(A1) 申请公布日期 2013.11.27
申请号 EP20120737099 申请日期 2012.01.18
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 KATO YOSHIHIRO;OGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO
分类号 C08L63/00;C08J5/24;C08K3/00;C08K3/22;C08K3/24;H05K1/03 主分类号 C08L63/00
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