发明名称 |
POLISHING PAD WITH CONTROLLED VOID FORMATION |
摘要 |
<p>A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.</p> |
申请公布号 |
EP2271463(A4) |
申请公布日期 |
2013.11.27 |
申请号 |
EP20080873724 |
申请日期 |
2008.10.02 |
申请人 |
INNOPAD, INC. |
发明人 |
LEFEVRE, PAUL;WELLS, DAVID ADAM;JIN, MARC C.;HSU, OSCAR K.;ALDEBORGH, JOHN ERIK;WU, GUANGWEI;MATHEW, ANOOP;QIAO, SCOTT, XIN |
分类号 |
B24B37/24 |
主分类号 |
B24B37/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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