| 摘要 |
<p>An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the terminal pins are inserted. The functional component, disposed away from the base plate, is mounted on a printed circuit board to be electrically connected to at least one of the terminal pins. While enclosing the functional component, the resin package is held in contact with the upper surface of the base plate.</p> |
