| 摘要 |
<p>An electronic component mounting module (2) according to an embodiment includes a mounting member (21), a pressing member (22), and a fastening member (23) . The mounting member (21) includes a component housing frame (201) that houses an electronic component (41, 42) generating heat during operation so as to be in contact with at least a part of a side face thereof, and that holds the electronic component (41, 42) so as to expose a main heat radiating surface thereof toward a heat sink (11). The pressing member (22) is mounted on the mounting member (21), and presses the mounting member (21) and the electronic component (41, 42) at the same time toward the heat sink (11) through a heat sink layer (13). The fastening member (23) presses the pressing member (22) toward the heat sink (11), and thus presses to fix the component housing frame (201) and the electronic component (41, 42) to the heat sink layer (13).</p> |
