摘要 |
Light emitting elements (110) are situated on a film (210), then surrounded by a reflective structure (250) that is placed or formed on the film (210). Thereafter, the reflective structure (250) is filled with an encapsulant (270), affixing the light emitting element (110) within the reflective structure (250). The film (210) may then be removed, exposing the contacts (230) for coupling the light emitting element (110) to an external power source. The encapsulated light emitting elements (110) within the reflective structure (250) are diced/singulated to provide the individual light emitting devices. The encapsulant (270) may be molded or otherwise shaped to provide a desired optical function. |