| 摘要 |
PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film, and a semiconductor device using the same are provided to obtain the resin film with the superior heat resistance characteristic and maintain the mechanical characteristic of the resin film regardless of hardening temperature. CONSTITUTION: A positive type photo-sensitive resin composition includes polybenzoxazole precursor, a photo-sensitive diazoquinone compound, a bis-benzocyclobutene compound or a polymer obtained from a thermal cross-linking process with respect to the bis-benzocyclobutene compound, and a solvent. The polybenzoxazole precursor includes a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2. The bis-benzocyclobutene compound is represented by chemical formula 3. In the chemical formulas 1 and 2, the X1 and the X2 are respectively aromatic organic groups. The Y1 is an alicyclic organic group with the double bond or an aliphatic organic group with the double bond. The Y2 is alicyclic organic group or an aliphatic organic group. In the chemical formula 3, the X3 is selected from a group including hetero atom substituted or non-substituted aromatic organic group, alicyclic organic group, aliphatic organic group, and the combination of the same. |
