| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem wherein when a resin substrate with a built-in electronic component is soldered by reflow, a solder fillet used for mounting the built-in electronic component is heated, remelted and expanded, thereby causing short-circuiting between terminal electrodes of the electronic component. <P>SOLUTION: A molten solder deriving hole, which communicates between the solder fillet and the surface of a resin layer, is formed in the resin layer so that the remelted solder is derived outside. Any one of a metal wire excellent in wettability with solder, a metal wire with a solder layer formed in the surface thereof, and a metal wire with a mold release agent applied to the surface thereof may be inserted in the molten solder deriving hole. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
