| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to increase a transfer speed of a semiconductor chip by mounting the semiconductor chip to face the upper and lower sides of a through wiring substrate for reducing an electrical connection path. CONSTITUTION: A through wiring substrate (100) includes an upper pattern (104), a lower pattern (106), and a through pattern (105). An upper semiconductor chip (110) is electrically connected to the upper pattern. A first rewiring pattern layer (130) is electrically connected to the lower pattern. A lower semiconductor chip (140) is electrically connected to the first rewiring pattern layer. The through wiring substrate provides an electrical connection path between the upper semiconductor chip and the lower semiconductor chip. |
