发明名称
摘要 PROBLEM TO BE SOLVED: To manufacture a printed circuit board which forms circuits with less signal transmission speed difference, with no requirement for forming the circuit in inclined arrangement. SOLUTION: A prepreg A is used for manufacturing a laminated board B by impregnating a cloth 3 formed by weaving warp 1 and weft 2 with resin, which is dried and cured, and is also used for manufacturing a printed circuit board C by providing a circuit 5 on the surface of the laminated board B. Such cloth 3 as warp 1 and weft 2 are arranged as follows is used: when a straight line L<SB>1</SB>which is parallel to the end edge along the warp 1 of the prepreg A is drawn on the surface of the prepreg A, the number of frequency crossed by the straight line L<SB>1</SB>over the warp 1 and a section 6 between the adjacent warps 1 and 1 is &ge;2 per 10 cm, and, when a straight line L<SB>2</SB>which is vertical to the end edge of the prepreg A is drawn on the surface of the prepreg A, the number of frequency crossed by the straight line L<SB>2</SB>over the weft 2 and over a section 7 between adjacent wefts 2 and 2 is &ge;2 per 10 cm. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP5351609(B2) 申请公布日期 2013.11.27
申请号 JP20090127023 申请日期 2009.05.26
申请人 发明人
分类号 H05K1/03 主分类号 H05K1/03
代理机构 代理人
主权项
地址