| 摘要 |
The present invention provides a rolled copper foil with high curving resistance and high bending resistance. The rolled copper foil includes a main surface and multiple crystal surfaces, which are parallel to the main surface and comprises a {022} surface, a {002} surface, a {113} surface, a {111} surface, and a {133} surface. The diffraction peak ratios of the respective crystal surfaces are calculated from x-ray diffraction measurement using a 2θ/θ method applied on the main surface, are converted into 100 of a sum value thereof, and satisfy a formula of I{022} + I{002} ≥ 75. In powdered copper having the {022} surface, the {113} surface, the {111} surface, the {133} surface, and the {002} surface, the diffraction peak ratios of the respective crystal surfaces and full widths at half maximum of diffraction peaks for the diffraction peak ratios of which the sum value is converted into 100 satisfy [(I{113} / I0{113}) X 竊�섭竊⑨서{113}] + [(I{111} / I0{111}) X 竊�섭竊⑨서{111}] + [(I{133} / I0{133}) X 竊�섭竊⑨서{133}] ≤ 1.5. The ten point average roughness of the main surface is less than or equal to 1.2 μm. [Reference numerals] (AA) Start a process for manufacturing rolled copper foil;(BB) Repeated process;(CC) (Repetition a predetermined number of times) repeated process;(DD) End the process for manufacturing rolled copper foil;(S10) Process for preparing an ingot;(S20) Hot rolling process;(S31) Cold rolling process;(S32) Annealing process;(S40) Final cold rolling process;(S50) Surface treatment process |
