| 摘要 |
The present invention relates to a method and apparatus for temporarily bonding a coverlay on the surface of a circuit board to insulate the surface of a substrate and to protect a circuit. The apparatus for temporarily bonding the coverlay includes a supply unit, a pickup unit, a first X axis transfer unit, a camera for photographing the coverlay, a temporary bonding table, a camera for photographing the circuit board, and a Y axis transfer unit. [Reference numerals] (S100) Step of providing a cover lay to a cover lay supplying tool with multiple measurement points formed;(S200) Step of attaching the cover lay to the adhesive pad of a pick up tool and picking up the cover lay;(S300) Step of providing and settling a circuit substrate on a pre-welding table;(S400) Step of partially transporting the cover lay regarding a X axis to the position with a phototaking camera installed using a first X axis transportation tool;(S500) Step of measuring the position of the cover lay in polar coordinates by making a spinning motor to rotate the pick up tool's adhesive pad and making the cover lay photographing camera to take pictures of the multiple measurement points formed on the spinning cover lay;(S600) Step of transporting the circuit substrate to a Y axis by a Y axis transportation tool and measuring the position of the circuit substrate in orthogonal coordinates by making a circuit substrate photographing camera, which is transported to the X axis by a second X axis transportation tool to take pictures of the circuit substrate;(S700) Step of transporting the pre-welding table with the circuit substrate to the Y axis according to the measurement result, transporting the pick up tool to which the cover lay is attached to the X axis, and transporting/adjusting the cover lay and circuit substrate to the pre-welding position by rotating the adhesive pad;(S800) Step of pre-welding the cover lay on the upper part of the circuit substrate |
