| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor which is excellent in a balance of flowability, continuous moldability, handleability, and adhesiveness; and to provide an economic semiconductor apparatus which is prepared by sealing a semiconductor device by its cured material and is excellent in reliability. <P>SOLUTION: The resin composition for sealing a semiconductor is an epoxy resin comprising one or two or more components and is characterized by comprising: an epoxy resin (A) containing a component (A1) comprising a polymer containing a structural unit represented by formula (2); a phenol resin-based curing agent (B); and an inorganic filler (C). (In the formula, R1 independently is a 1-6C hydrocarbon group and a is an integer of 0 to 3, R6 independently is a 1-6C hydrocarbon group and b is 0 or an integer of 1 to 4, R7, R8, R9 and R10 independently are a hydrogen atom or a 1-6C hydrocarbon group). <P>COPYRIGHT: (C)2011,JPO&amp;INPIT</p> |
