发明名称 Amplifier circuit with a low inductance bond wire arrangement
摘要 <p>An amplifier circuit is disclosed. The amplifier circuit comprises an amplifier IC (22); a control IC (24); a signal connections connected between the amplifier IC (22) and the control IC (24), the signal connections (44, 54) being adapted to communicate control signals between the control IC (24) and the amplifier IC (22); and a reference connections (42, 52) connected between the amplifier IC (22) and the control IC (24), the reference connections (42, 52) being adapted to communicate a reference voltage between the amplifier IC (22) and the control IC (24). The reference connections (42, 52) are substantially parallel to the signal connections (44 , 52). Both the reference connections (42, 52) and the signal connections (44, 54) are comprised of either wire or ribbon bonds.</p>
申请公布号 EP2667409(A1) 申请公布日期 2013.11.27
申请号 EP20120168696 申请日期 2012.05.21
申请人 NXP B.V. 发明人 VAN DER HEIJDEN, MARK;ACAR, MUSTAFA;APOSTOLIDOU, MELINA;DE LANGEN, MICHEL
分类号 H01L23/66 主分类号 H01L23/66
代理机构 代理人
主权项
地址