| 摘要 |
PURPOSE: A positive photosensitive resin composition, a photosensitive resin film using the same, and a semiconductor device using the film are provided to have excellent sensitivity and high resolution in a process for forming a pattern at a temperature below 200°C and to obtain excellent mechanical properties through a crosslink bond of a crosslinking agent and a polybenzoxazole in thermal hardening of 300°C or greater. CONSTITUTION: A positive photosensitive resin composition includes: a repeating unit which is marked as a chemical formula 1 or a chemical formula 2; a polybenzoxazole precursor having a thermal polymerizable functional group on the terminal of the precursor; a photosensitive diazoquinone compound, a silane compound, a phenolic compound; a crosslinking agent having the thermal polymerizable functional group; and a solvent. |
