发明名称 MOUNTED LED PACKAGE AND WIRING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT
摘要 The present invention discloses an LED module mounted on a flexible printed circuit board and a wiring structure. The disclosed LED module according to the present invention mounts an LED chip and a connection part on an insulation material and is mounted on an anode wire and a cathode wire which are arranged on the flexible printed circuit board in parallel. A distance is controlled by combining the LED module with the insulation material whose size is controlled without changing a wire pattern when the control of the distance with the LED chip is required.
申请公布号 KR101333987(B1) 申请公布日期 2013.11.27
申请号 KR20120075003 申请日期 2012.07.10
申请人 HYDIS TECHNOLOGIES CO., LTD. 发明人 HA, SEUNG SU;YOO, JE GEON
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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