发明名称 |
MOUNTED LED PACKAGE AND WIRING STRUCTURE OF FLEXIBLE PRINTED CIRCUIT |
摘要 |
The present invention discloses an LED module mounted on a flexible printed circuit board and a wiring structure. The disclosed LED module according to the present invention mounts an LED chip and a connection part on an insulation material and is mounted on an anode wire and a cathode wire which are arranged on the flexible printed circuit board in parallel. A distance is controlled by combining the LED module with the insulation material whose size is controlled without changing a wire pattern when the control of the distance with the LED chip is required. |
申请公布号 |
KR101333987(B1) |
申请公布日期 |
2013.11.27 |
申请号 |
KR20120075003 |
申请日期 |
2012.07.10 |
申请人 |
HYDIS TECHNOLOGIES CO., LTD. |
发明人 |
HA, SEUNG SU;YOO, JE GEON |
分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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