发明名称
摘要 A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
申请公布号 JP5354223(B2) 申请公布日期 2013.11.27
申请号 JP20110527098 申请日期 2008.12.25
申请人 发明人
分类号 H01P7/04;H01P1/205 主分类号 H01P7/04
代理机构 代理人
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