发明名称 Light-emitting diode device
摘要 A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
申请公布号 US8592844(B2) 申请公布日期 2013.11.26
申请号 US201113016594 申请日期 2011.01.28
申请人 IZUTANI SEIJI;HARA KAZUTAKA;FUKUOKA TAKAHIRO;UCHIYAMA HISAE;HIRANO HITOTSUGU;NITTO DENKO CORPORATION 发明人 IZUTANI SEIJI;HARA KAZUTAKA;FUKUOKA TAKAHIRO;UCHIYAMA HISAE;HIRANO HITOTSUGU
分类号 H01L33/64 主分类号 H01L33/64
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