发明名称 |
Light-emitting diode device |
摘要 |
A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
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申请公布号 |
US8592844(B2) |
申请公布日期 |
2013.11.26 |
申请号 |
US201113016594 |
申请日期 |
2011.01.28 |
申请人 |
IZUTANI SEIJI;HARA KAZUTAKA;FUKUOKA TAKAHIRO;UCHIYAMA HISAE;HIRANO HITOTSUGU;NITTO DENKO CORPORATION |
发明人 |
IZUTANI SEIJI;HARA KAZUTAKA;FUKUOKA TAKAHIRO;UCHIYAMA HISAE;HIRANO HITOTSUGU |
分类号 |
H01L33/64 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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