发明名称 |
LED package structure and manufacturing method, and LED array module |
摘要 |
An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
|
申请公布号 |
US8592231(B2) |
申请公布日期 |
2013.11.26 |
申请号 |
US20100883815 |
申请日期 |
2010.09.16 |
申请人 |
SHIN SU-HO;KWEON SOON-CHEOL;SHIN KYU-HO;KWON KI-HWAN;CHOI SEUNG-TAE;MOON CHANG-YOUL;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN SU-HO;KWEON SOON-CHEOL;SHIN KYU-HO;KWON KI-HWAN;CHOI SEUNG-TAE;MOON CHANG-YOUL |
分类号 |
H01L21/00;H01L33/62;H01L33/64 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|