| 摘要 |
A headphone includes a pad which is brought into contact with a human head, an enclosure which outputs an audio, and a dome as means for adjusting quality of the audio output by resonating or absorbing the sound wave emitted from the enclosure. The dome has no parts other than those used for absorbing and reflecting audio and is almost hollow. In the dome is arranged a circuit substrate by using a circuit support part having a shape not blocking the air flowing in the dome. Such a circuit substrate is also built in the other headphone. The circuit substrates arranged in the dome of the headphone are connected by a cable arranged inside a head band or an FPC for transmission of a signal and power supply. Thus, it is possible to provide an output device which can solve the problem of the dimensions for containing operation processing devices and the problem of heat dissipation.
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