| 摘要 |
<p>An apparatus for cutting a liquid crystal display (LCD) device is disclosed for a fast cutting of liquid crystal display panels, the apparatus including: a table on which a first mother substrate a second mother substrate having N×M (N,M≧2) liquid crystal display panels are loaded; a guide bar disposed at one side of the first and second mother substrates; and N scribing units each installed at the guide bar and configured to move along the guide bar to cut the first and second mother substrates, wherein each of the scribing units includes first and second supporting portions movable up and down along the guide bar, first and second rotational shafts installed at the first and second supporting portions, respectively, and first and second cutting members installed at the first and second rotational shafts, respectively, to cut the first and second mother substrates, respectively, in cooperation with the rotation of the rotational shafts, wherein the first and second cutting members of each scribing unit are installed such that a spacing therebetween is adjustable as wide as a width of a pad unit formed on the first mother substrate, wherein the first and second cutting members cutting the first and second mother substrates in an aligned state at one side of liquid crystal display panels where the pad unit is not formed, and simultaneously cut the first and second mother substrates with being spaced from each other by a width of the pad unit at another side of the liquid crystal display panels where the pad unit is formed.</p> |
