发明名称 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
摘要 |
Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the microelectronic device includes a microelectronic substrate having a first surface, a second surface facing opposite from the first surface, and a plurality of active devices at least proximate to the first surface. The second surface has a plurality of heat transfer surface features that increase the surface area of the second surface. In another embodiment, an enclosure having a heat sink and a single or multi-phase thermal conductor can be positioned adjacent to the second surface to transfer heat from the active devices.
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申请公布号 |
US8592254(B2) |
申请公布日期 |
2013.11.26 |
申请号 |
US201213612337 |
申请日期 |
2012.09.12 |
申请人 |
LINDGREN JOSEPH T.;FARNWORTH WARREN M.;HIATT WILLIAM M.;SINHA NISHANT;MICRON TECHNOLOGY, INC. |
发明人 |
LINDGREN JOSEPH T.;FARNWORTH WARREN M.;HIATT WILLIAM M.;SINHA NISHANT |
分类号 |
H01L21/44;H01L23/367;H01L23/427 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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