发明名称 Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board
摘要 A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.]
申请公布号 US8592130(B2) 申请公布日期 2013.11.26
申请号 US20090995301 申请日期 2009.05.22
申请人 MIYASAKA MASAHIRO;MURAMATSU YUKIKO;HITACHI CHEMICAL COMPANY, LTD. 发明人 MIYASAKA MASAHIRO;MURAMATSU YUKIKO
分类号 G03F7/00;G03F7/004;G03F7/028;G03F7/11;G03F7/40 主分类号 G03F7/00
代理机构 代理人
主权项
地址