发明名称 Large dimension device and method of manufacturing same in gate last process
摘要 An integrated circuit device and methods of manufacturing the same are disclosed. In an example, integrated circuit device includes a capacitor having a doped region disposed in a semiconductor substrate, a dielectric layer disposed over the doped region, and an electrode disposed over the dielectric layer. At least one post feature embedded in the electrode.
申请公布号 US8592945(B2) 申请公布日期 2013.11.26
申请号 US201113160096 申请日期 2011.06.14
申请人 CHUANG HAK-LAY;ZHU MING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHUANG HAK-LAY;ZHU MING
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址