发明名称 RESIN COMPOSITON FOR HIGHLY THERMAL CONDUCTIVE INSULATING MATERAIL AND INSULATING FIME
摘要 PURPOSE: A resin composition is provided to offer an insulating material capable of realizing an excellent thermal conductivity without a degradation o inner voltage intensity. CONSTITUTION: A resin composition for insulating material comprises: a thermal conductive ceramic compound comprising alumina (Al2O3); graphene oxide; and a thermosetting resin. The graphene oxide is obtained from graphite oxide having more than 8.700Åof d-spacing. The thermosetting resin comprises more than one kind selected among epoxy resin, polyimide resin, phenoxy resin, and acrylic resin. The insulating film comprises: a thermosetting resin hardened on the film; graphene oxide and thermal conductive ceramic compound dispersed in the thermosetting resin. [Reference numerals] (AA) LED chip; (BB) Insulation film; (CC) Metal PCB; (DD) Graphene oxide; (EE) Polymer matrix; (FF) Ceramic powder; (GG) LED heat discharge package view; (HH) Ceramic/graphene oxide composite insulation film view
申请公布号 KR101333260(B1) 申请公布日期 2013.11.26
申请号 KR20120013947 申请日期 2012.02.10
申请人 发明人
分类号 H01B3/12;H01B3/22;H01B3/30;H01B17/62 主分类号 H01B3/12
代理机构 代理人
主权项
地址