| 摘要 |
On a multilayer wiring board which has a plurality of wiring pattern stacked in sequence separately from one another, insulating members each positioned between the plurality of wiring patterns, and interlayer connection bodies electrically connecting the plurality of wiring patterns and in which a voltage conversion IC is built in, a first capacitor, a second capacitor, and an inductor are mounted, the other of electrode portions in the first capacitor or one of electrode portions in the second capacitor is positioned between an input section of the first capacitor and the inductor, and the other of the electrode portions or the one of the electrode portions is electrically set to ground.
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