DEVICE FOR CONNECTING SEMICONDUCTOR CHIP FOR TESTING SEMICONDUCTOR MODULE

摘要

A semiconductor chip connection device for testing a semiconductor module is provided. The semiconductor chip connection device for testing a semiconductor module comprises a base on which a semiconductor module is laid; a moving unit installed to relatively move with regard to the base and fixed to the base corresponding to one region of the semiconductor module laid on the base; and a socket unit combined with the moving unit and receiving a semiconductor chip connected to the region of the semiconductor module.