发明名称 |
Substrate inductive devices and methods |
摘要 |
Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed. |
申请公布号 |
US8591262(B2) |
申请公布日期 |
2013.11.26 |
申请号 |
US20100876003 |
申请日期 |
2010.09.03 |
申请人 |
SCHAFFER CHRISTOPHER P.;GUTIERREZ AURELIO J.;PULSE ELECTRONICS, INC. |
发明人 |
SCHAFFER CHRISTOPHER P.;GUTIERREZ AURELIO J. |
分类号 |
H01R13/66;H01F21/02;H01F27/24;H01F27/28 |
主分类号 |
H01R13/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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