发明名称 |
Methods for cleaning a semiconductor substrate |
摘要 |
A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.
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申请公布号 |
US8591662(B2) |
申请公布日期 |
2013.11.26 |
申请号 |
US201213661929 |
申请日期 |
2012.10.26 |
申请人 |
FREER ERIK M.;DELARIOS JOHN;MIKHAYLICHENKO KATRINA;RAVKIN MICHAEL;KOROLIK MIKHAIL;REDEKER FRED C.;LAM RESEARCH CORPORATION |
发明人 |
FREER ERIK M.;DELARIOS JOHN;MIKHAYLICHENKO KATRINA;RAVKIN MICHAEL;KOROLIK MIKHAIL;REDEKER FRED C. |
分类号 |
B08B7/00 |
主分类号 |
B08B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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