发明名称 Grounding structures for header and receptacle assemblies
摘要 A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder that has a first side and an opposite second side. The conductive holder has a front coupled to the front housing. The conductive holder holds a frame assembly. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The dielectric frame is received in the conductive holder. The contacts extend from the conductive holder for electrical termination. A first ground shield is coupled to the first side, is electrically connected to the conductive holder and has grounding beams and grounding fingers that extend forward of the front of the conductive holder for electrical connection to a corresponding header shield of the header assembly. A second ground shield is coupled to the second side, is electrically connected to the conductive holder and has grounding beams and grounding fingers that extend forward of the front of the conductive holder for electrical connection to a corresponding header shield of the header assembly.
申请公布号 US8591260(B2) 申请公布日期 2013.11.26
申请号 US201113182237 申请日期 2011.07.13
申请人 DAVIS WAYNE SAMUEL;WHITEMAN, JR. ROBERT NEIL;TYCO ELECTRONICS CORPORATION 发明人 DAVIS WAYNE SAMUEL;WHITEMAN, JR. ROBERT NEIL
分类号 H01R9/03 主分类号 H01R9/03
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