| 摘要 |
<p>PURPOSE: A solvent-free adhesive resin composition is provided to manufacture an environment-friendly solvent-free adhesive, and to have low peeling force and stronger maintaining force which are suitable for a protective film. CONSTITUTION: A solvent-free adhesive resin composition comprises 5-20 parts by weight of a (meth)acrylic acid ester monomer having an C1-14 alkyl group, 1-10 parts by weight of a photoinitiator, 30-70 parts by weight of a silicone-urethane-acrylate oligomer. The photoinitiator is selected from anα-hydroxyketone type compound, a benzylketal type compound,α-aminoketone type compound, an acryl phosphine type compound, and metallocene type compound. A manufacturing method of an adhesive film comprises: a step of spreading the solvent-free adhesive resin composition to one side or both sides of the film; and a step of curing the solvent-free adhesive resin.</p> |
